3D-ICE
Thermal simulator for stacked integrated circuits
3D-ICE is a compact transient thermal simulator for 3D stacked integrated circuits with inter-tier liquid cooling. It models heat dissipation using an equivalent resistor-capacitor network and solves the resulting system of differential equations to predict temperature distributions across stacked dies, supporting both linear and nonlinear thermal models with pluggable heat sink configurations.
Low-LevelSimulator
- Research papers
- Technical
- 3D-ICE 3.0: efficient nonlinear MPSoC thermal simulation with pluggable heat sink models
- 3D-ICE: a compact thermal model for early-stage design of liquid-cooled ICs
- 3D-ICE: Fast compact transient thermal modeling for 3D-ICs with inter-tier liquid cooling
- Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries
The Embedded Systems Laboratory (ESL) is part of the Institute of Electrical Engineering at EPFL, and focuses on the definition of system-level multi-objective design methods, optimization methodologies and tools for high-performance embedded systems and nano-scale Multi-Processor System-on-Chip (MPSoC) architectures targeting the Internet-of-Things (IoT) Era.
This page was last edited on 2022-07-05.
This page was last edited on 2022-07-05.